Method for manufacturing semiconductor device

Details Method for manufacturing semiconductor device Method for manufacturing semiconductor device

1999-11-04

2000-10-24

Smith, Matthew

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438659, 438584, 438592, 438605, 438627, 438643, 438661, H01L 2144

Patent

active

061367087

ABSTRACT:
A barrier film 5 such as silicon oxide film or the like is formed on the back surface of a semiconductor substrate. Then, a copper-based metal film is formed on the principal surface of the semiconductor substrate. (Selected Drawing: FIG. 2)

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patent: 5121183 (1992-06-01), Ogasawara et al.
patent: 5574741 (1996-11-01), Arimoto
patent: 5639677 (1997-06-01), Lee et al.
patent: 5654245 (1997-08-01), Allen
patent: 5821168 (1998-10-01), Jain

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