Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1998-08-28
2000-10-24
Chu, John S.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
4302851, 430905, 430910, 430326, 430325, G03F 7004
Patent
active
061365017
ABSTRACT:
The present invention provides novel polymers and photoresist compositions that comprise the polymers as a resin binder component. The photoresist compositions of the invention can provide highly resolved relief images upon exposure to short wavelengths, including 193 nm and 248 nm. The resists of the invention are also useful or imaging at other wavelengths such as 365 nm. Polymers of the invention include those that comprise a photogenerated acid-labile unit that is ester group that comprises an alkyl moiety having about 5 or more carbon atoms and at least two secondary, tertiary or quaternary carbon atoms. The alkyl moiety of the ester group can be a noncyclic or single ring alicyclic group. The carboxyl (C.dbd.O(O)) oxygen of the ester group is often preferably directly bonded to a quaternary carbon atom.
REFERENCES:
patent: 4491628 (1985-01-01), Ito et al.
patent: 5362600 (1994-11-01), Sinta et al.
patent: 5492793 (1996-02-01), Breyta et al.
patent: 5962184 (1999-10-01), Allen et al.
patent: 5968713 (1999-10-01), Nozaki et al.
Barclay George G.
Taylor Gary N.
Trefonas, III Peter
Cairns S. Matthew
Chu John S.
Clarke Yvette M
Corless Peter F.
Frickey Darryl P.
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