Dry etching method

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

1566471, 1566511, 1566621, H01L 2100

Patent

active

055000797

ABSTRACT:
A semiconductor material to be etched is held in a reaction chamber at a predetermined temperature. A reactive etching gas such as a chlorine gas is introduced into the reaction chamber for a first period of time. Thereafter, the reaction chamber is evacuated for a second period of time, and ultraviolet radiation is applied to the semiconductor material for a third period of time within the second period of time for thereby etching the semiconductor material to a depth on the order of a molecular or atomic layer.

REFERENCES:
patent: 4643799 (1987-02-01), Tsujii et al.
patent: 4693779 (1987-09-01), Okuhira et al.
Patent Abstracts of Japan, vol. 11, No. 17 (E-471), 17 Jan. 1987 & JP-A-61 189 644 (Hitachi Ltd.) 23 Aug. 1986.
Takashi Meguro et al., "Layer-by-layer controlled digital etching by means of an electron-beam-excited plasma system", Japanese Journal of Applied Physics, vol. 29, No. 10, Oct. 1990, Tokyo, Japan, pp. 2216-2219.
Y. Horiike et al., "Excimer-laser etching on Silicon", Applied Physics A. Solids and Surfaces, vol. A44, No. 4, Dec. 1987, Heidelberg DE, pp. 313-332.
Patent Abstracts of Japan, vol. 11, No. 15, No. 308 (E-1097) 7 Aug. 1991 & JP-A-31 10 844 (Rikagaku Kenkyusho) 10 May 1991.
T. Meguro et al., "Digital etching of GaAs: New approach of dry etching to atomic ordered processing", Applied Physics Letters, vol. 56, No. 16, 16 Apr. 1990, New York, US, pp. 1552-1554.
J. Gary Eden, "Photochemical processing of semiconductors: New applications for visible and ultraviolet lasers", IEEE Circuits and Devices Magazine, vol. 2, No. 1, Jan. 1986, New York US, pp. 18-24.
P. D. Brewer et al., "Laser-assisted dry etching", Solid State Technology, vol. 28, No. 4, Apr. 1985, Washington, US, pp. 273-278.
P. D. Brewer et al., "Dry, laser-assisted rapid HBr etching of GaAs", Applied Physics Letters, vol., 47, No. 3, Aug. 1985, New York, US, pp. 310-312.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Dry etching method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dry etching method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dry etching method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1957083

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.