Flip chip semiconductor mounting structure with electrically con

Details Flip chip semiconductor mounting structure with electrically con Flip chip semiconductor mounting structure with electrically con

1997-03-24

1999-02-09

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257676, 257687, 257688, 257692, 257693, 257711, 257735, 257737, 257778, 257738, H01L 21283

Patent

active

058698868

ABSTRACT:
A semiconductor chip is flip chip bonded on a substrate wherein the semiconductor chip has a first surface on which bumps are provided. An insulating sealing resin is provided in a space defined between the semiconductor chip and the substrate and also around the semiconductor chip. An electrically conductive resin is provided which extends over a least a part of a second surface of the semiconductor chip, a part of the sealing resin and a ground pattern provided over the substrate.

REFERENCES:
patent: 4922321 (1990-05-01), Arai et al.
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5433822 (1995-07-01), Mimura et al.
patent: 5508561 (1996-04-01), Tago et al.

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