Process of etching with plasma etch gas

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156646, 156656, 156665, 156667, 204192E, 252 791, C23F 100

Patent

active

041826469

ABSTRACT:
A method of etching aluminum in a planar plasma etcher is disclosed wherein a first plasma of carbon tetrachloride is developed followed by a second plasma of carbon tetrachloride and chlorine. By generating the specific claimed plasmas at specific partial pressures in two steps, the selectivity of the etching operation is greatly enhanced while disadvantages encountered in etching aluminum with prior art techniques are greatly reduced.

REFERENCES:
patent: 3994793 (1976-11-01), Harvilchuck et al.
patent: 4030967 (1977-06-01), Ingrey et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process of etching with plasma etch gas does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of etching with plasma etch gas, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of etching with plasma etch gas will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1940744

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.