Method of joining an electrical contact element to a substrate

Fishing – trapping – and vermin destroying

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437192, 437209, 437189, H01L 2144

Patent

active

056704186

ABSTRACT:
An outer coating of an electrically conductive material having low wetability with respect to solder is deposited over a gold coating previously deposited on an electrical contact element. After soldering the contact element to a substrate, the portion of the outer coating not covered by solder is removed from the contact element. The method of joining a contact element to a substrate in accordance with the present invention effectively solves the problem of solder climb to the critical contact area of the element without the need to provide masking or apply plating resist coatings to selected areas of the element.

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