Method of fabricating print head for thermal printer

Details Method of fabricating print head for thermal printer Method of fabricating print head for thermal printer

1986-09-05

1987-12-01

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156630, 156634, 156649, 156652, 156656, 1566591, 219216, 346 76PH, C23F 100, C23F 102, B44C 122, C03C 1500

Patent

active

047102632

ABSTRACT:
A method of fabricating a print head for use in a thermal printer is similar to the additive (or lift-off) method of pattern transfer utilizing semiconductor fabrication technology except that a metal film is used instead of photoresist conventionally used. The method is initiated by glazing a substrate. Then, nickel is sputtered on the glazed substrate. That portion of the formed nickel film that lies under the heater portion of the head is removed by photoetching. Subsequently, the remaining nickel film is plated with nickel, and a chemically stable and heat-resistant insulator, such as Ta.sub.2 O.sub.5, is sputtered on the plated laminate. Thereafter, the plating layer and the nickel film are removed to leave the portion of the insulator layer that lies under the heater portion. The remaining layer protrudes to the heater portion.

REFERENCES:
patent: 4076860 (1978-02-01), Kuroda
patent: 4169032 (1979-09-01), Haase et al.
patent: 4617088 (1986-10-01), Nishiguchi et al.
Kanazawa et al., A High Speed, High Performance, Scanning Thin Film Thermal Printhead, Q-0002748, 55.9.12, pp. 122-127.

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