Method of processing siloxane-polyimides for electronic packagin

Details Method of processing siloxane-polyimides for electronic packagin Method of processing siloxane-polyimides for electronic packagin

1989-04-24

1990-01-30

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 1, 134 3, 156629, 156633, 156644, 156646, 156651, 156655, 156668, 1562726, 1562728, 20419236, 21912169, 21912185, 427 38, 427307, 427309, B44C 122, C03C 1500, B29C 3700, B32B 3100

Patent

active

048971537

ABSTRACT:
A method of forming a multilayer metallization pattern using siloxane polyimide dielectric layers comprises forming the first siloxane polyimide layer, laser etching holes in the first layer, plasma etching the first layer to be sure the holes are clean, then cleaning the surface of the first layer in an etchant for silicon oxide, after which the metallization layer is formed and patterned and a second siloxane polyimide layer is formed thereover with good adhesion.

REFERENCES:
patent: 4504349 (1985-03-01), Ueno et al.
patent: 4731156 (1988-03-01), Montmarquet
patent: 4764485 (1988-08-01), Loughran et al.
patent: 4772348 (1988-09-01), Hirokawa et al.

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