Method of fabricating single-crystal substrates of silicon carbi

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156612, 156613, 156614, 156DIG64, 156DIG99, 428698, C30B 2520

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active

048971499

ABSTRACT:
A single-crystal substrate of silicon carbide comprising a single-crystal substrate member of a material other than .alpha.-SiC, and a single-crystal layer of .alpha.-SiC formed over the substrate member with a ground layer provided between the substrate member and the single-crystal layer, the ground layer comprising a single-crystal layer of nitride of AlN, GaN or Al.sub.x Ga.sub.1-x N (0<x<1) having a hexagonal crystal structure or a crystal layer of the same structure made of a mixture of SiC and at least one of the nitrides; and a method for fabricating the same.

REFERENCES:
patent: 3634149 (1972-01-01), Knippenberg et al.
patent: 3960619 (1976-06-01), Seiter
patent: 4028149 (1977-06-01), Deines et al.
patent: 4147572 (1979-04-01), Vodakov et al.
patent: 4161743 (1979-07-01), Yanezawa et al.
patent: 4382837 (1983-05-01), Rutz
"Growth of Silicon Carbide from Solution", the Marshall article from the Material Research Bulletin, vol. 4, pp. S73-S84 (1969).
"Growth Phenomena in Silicon Carbide", the Knippenberg article, Chapter 8, entitled "The Growth of Silicon Carbide by Recrystallization and Sublimation", pp. 244-266, vol. 18, No. 3.
Chapter of the Knippenberg article entitled "Preparative Procedures" at pp. 171-179.

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