Method of forming films over inner surface of cylindrical member

Details Method of forming films over inner surface of cylindrical member Method of forming films over inner surface of cylindrical member

1996-10-15

2000-10-03

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419212, 20419215, 20419216, 427294, 427237, 427527, 427530, 427531, 427585, C23C 1434

Patent

active

061267937

ABSTRACT:
The present invention relates to a method of forming an intermediate film and a hard cabon film over the inner surface of a cylindrical member having a bore, such as a bushing or a cylinder, with the hard carbon film being formed on the intermediate film with a uniform thickness, greatly enhancing of abrasion resistance of the inner surface. The cylindrical member is placed in a vacuum vessel, an auxiliary electrode of an intermediate film forming material, such as a titanium-silicon alloy or the like, is inserted in the bore of the cylindrical member, a sputtering gas is supplied into the vacuum vessel, a voltage is applied to the auxiliary electrode to produce a plasma around the auxiliary electrode in order that the intermediate film forming material is sputtered from the auxiliary electrode and an intermediate film is formed over the inner surface of the cylindrical member. Subsequently, a gas containing carbon, such as methane gas or the like, is supplied into the vacuum vessel, and a voltage is applied to the cylindrical member to produce a plasma in the vacuum vessel in order that a hard carbon film (DLC film) is formed on the previously formed intermediate film over the inner surface of the cylindrical member.

REFERENCES:
patent: 4374722 (1983-02-01), Zega
patent: 4859490 (1989-08-01), Ikegaya et al.
patent: 5511587 (1996-04-01), Miya et al.
patent: 5605714 (1997-02-01), Dearnaley et al.
patent: 5626963 (1997-05-01), Hirano et al.
patent: 5688557 (1997-11-01), Lemelson et al.
patent: 5693376 (1997-12-01), Fetherston et al.
patent: 5719410 (1998-02-01), Sueshiro et al.

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