Insulating film formed using an organic silane and method of pro

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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Other Related Categories

257 66, 257410, 257411, H01L 2701, H01L 2976, H01L 2994, H01L 31062

Type

Patent

Status

active

Patent number

060256303

Description

ABSTRACT:
A silicon oxide film is formed to cover an island non-monocrystalline silicon region by plasma CVD using an organic silane having ethoxy groups (e.g., TEOS) and oxygen as raw materials, while hydrogen chloride or a chlorine-containing hydrocarbon (e.g., trichloroethylene) of a fluorine-containing gas is added to the plasma CVD atmosphere, preferably in an amount of from 0.01 to 1 mol % of the atmosphere so as to reduce the alkali elements from the silicon oxide film formed and to improve the reliability of the film. Prior to forming the silicon oxide film, the silicon region may be treated in a plasma atmosphere containing oxygen and hydrogen chloride or a chlorine-containing hydrocarbon. The silicon oxide film is obtained at low temperatures and this has high reliability usable as a gate-insulating film in a semiconductor device.

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patent: 5037766 (1991-08-01), Wang
patent: 5275977 (1994-01-01), Ostubo et al.
patent: 5403772 (1995-04-01), Zhang et al.
patent: 5866932 (1999-02-01), Yamazaki et al.

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