Method for manufacturing a thin film recording head

Details Method for manufacturing a thin film recording head Method for manufacturing a thin film recording head

1997-02-12

2000-02-15

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

427523, 427525, 20419234, C23C 1434, C23C 1400, C23C 1412

Patent

active

060248459

ABSTRACT:
The invention provides a method of forming a thin film recording head including an upper magnetic substance, a lower magnetic substance cooperating with the upper magnetic substance to form a magnetic circuit, at least one coil layer interposed between the upper and lower magnetic substances, the coil layer being configured in a coil pattern, and an insulative layer interposed between the upper and lower magnetic substances and surrounding the coil pattern. The insulative layer is composed of hard-cured photoresist. A peak intensity ratio of a surface portion of the insulative layer is equal to or less than 0.5 relative to a peak intensity of aromatic C.dbd.C bonding, which aromatic is a main constituent of the photoresist. The peak intensity ratio represents an amount of hydrophilic radical. The invention suppresses the hydrophilic property of a hard-cured photoresist layer to thereby provide an advantage of enhancement of electrical insulation and reduction of noises of a thin film head.

REFERENCES:
patent: 4466839 (1984-08-01), Dathe et al.
patent: 4761199 (1988-08-01), Sato
patent: 4847327 (1989-07-01), Rupp et al.
patent: 5051856 (1991-09-01), Narishige et al.
patent: 5059278 (1991-10-01), Cohen et al.
patent: 5145554 (1992-09-01), Seki et al.
patent: 5281300 (1994-01-01), Amemori

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