Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-05-28
1993-10-12
Kunemund, Robert
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156613, 156DIG68, 423446, 427580, 427527, C30B 2508
Patent
active
052521745
ABSTRACT:
A method for manufacturing substrates for depositing diamond thin films is disclosed.
In the method, a hydrocarbon gas is discharge-decomposed, products generated by the discharge decomposition are accelerated to implant them in a surface layer of a substrate made of a material other than diamond and, thereby, the surface layer having bondings of carbon atoms and atoms compositing the substrate. Desirably, the substrate thus manufactured is subjected to a heat treatment at a temperature ranging from 800.degree. to 1,200.degree. C.
REFERENCES:
patent: 4997636 (1991-03-01), Prins
Kimura et al., "Thin Solid Films", 81 319-327 (1981).
Patent Abstracts of Japan, vol. 19, No. 247 (C-307) [1970], Oct. 3, 1985.
Deguchi Masahiro
Hirao Takashi
Garrett Felisa
Kunemund Robert
Matsushita Electric - Industrial Co., Ltd.
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