Hermetic package having a lead extending through an aperture in

Details Hermetic package having a lead extending through an aperture in Hermetic package having a lead extending through an aperture in

1989-06-16

1992-04-07

Hille, Rolf

357 68, H01L 2304, H01L 2310

Patent

active

051032902

ABSTRACT:
A hermetically sealed package for a semiconductor device includes a lid through which the leads of the device extend vertically away from the chip through an aperture in the lid which is hermetically sealed by the external terminal or electrode. The package is compact, lightweight and free of magnetic materials.

REFERENCES:
patent: 3740619 (1973-06-01), Rosvold
patent: 4023198 (1977-05-01), Malone et al.
patent: 4276558 (1981-06-01), Ho et al.
patent: 4338621 (1982-07-01), Braun
patent: 4544989 (1985-10-01), Nakabu et al.
patent: 4751482 (1988-06-01), Fukuta et al.
patent: 4807021 (1989-02-01), Okumura
patent: 4878846 (1989-11-01), Schroeder
patent: 4903120 (1990-02-01), Beene et al.
Denning, Richard, "Improved Contact Means for Multi-Emitter Power Transistors", RCA Technical Notes, TN No. 851, Mailed 10/16/89, pp. 1-3.

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