Method of making flip chip and BGA interconnections

Details Method of making flip chip and BGA interconnections Method of making flip chip and BGA interconnections

1998-06-16

2000-02-15

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228190, 228226, 2282341, 228254, 164322, B23K 3102, B23K 3512, B22C 920

Patent

active

060242752

ABSTRACT:
A method of producing an array of interconnecting contacts for an integrated circuit package, such as a flip chip integrated circuit, and connecting the array of interconnecting contacts to the package utilizes a mold to form the array and attach the array to the package. The method may also be used to interconnect two integrated circuit die. The mold defines a desired shape and relative position for a plurality of interconnecting contacts which make up the array of interconnecting contacts. The array of interconnecting contacts are molded by filling the mold with a desired contact forming material such as solder paste. The mold containing the molded array of interconnecting contacts is positioned adjacent to the integrated circuit package such that each interconnecting contact is positioned adjacent to a corresponding contact pad of the integrated circuit package. And finally, the molded interconnecting contacts are attached to their corresponding contact pads of the integrated circuit package. In the case in which solder paste is utilized as the molding material, the solder is reflowed to attach the array to the package.

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