Process for the manufacture of a three layer tape for tape autom

Details Process for the manufacture of a three layer tape for tape autom Process for the manufacture of a three layer tape for tape autom

1991-04-26

1992-10-20

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156643, 156644, 156654, 156656, 1566591, 156668, 156902, B44C 122, B29C 3700, C23F 100

Patent

active

051567164

ABSTRACT:
A method for the manufacture of an electronic circuit is provided. A non-conductive substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to be laminated to a metallic foil. The foil is bonded to the non-conductive substrate and patterned into a plurality of circuit traces. Mechanical stamping of the substrate is not required providing a means to inexpensively manufacture small quantities of a desired circuit configuration.

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Electronic Materials Handbook, ASM International, vol. 1 1989, pp. 476-479.

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