Thermal measuring and testing – Temperature measurement – In spaced noncontact relationship to specimen
Patent
1991-01-29
1992-04-07
Cuchlinski, Jr., William A.
Thermal measuring and testing
Temperature measurement
In spaced noncontact relationship to specimen
356 43, 356358, G01J 554
Patent
active
051022311
ABSTRACT:
A system for measuring the temperature of a semiconductor wafer 12 comprises a light source 14, a photodetector 20 which is operable to determine light intensity, and a mirror 18 in a predetermined fixed position from a beam splitter 16. The components are positioned such that light from the light source 14 impinges the beam splitter 16 and subsequently reflects off the mirror 18 and the wafer 12 and is received by the photodetector 20. Changes in the temperature of the wafer 12 are calculated based upon changes in the intensity of the received light which depends upon the expansion/contraction of the wafer. The absolute temperature may be calculated based on a known reference temperature and the changes in wafer 12 temperature. A second system and method for measuring the temperature of a semiconductor wafer which includes the use of a plurality of mirrors and two beam splitters is also disclosed.
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Davis Cecil J.
Fisher Wayne G.
Lawrence John D.
Loewenstein Lee M.
Cuchlinski Jr. William A.
Donaldson Richard L.
Gutierrez Diego F. F.
Kesterson James C.
Matsil Ira S.
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