Method of manufacture of thin film transistor SRAM device with a

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438158, 438159, H01L 218244

Patent

active

057211639

ABSTRACT:
A semiconductor device comprises a semiconductor substrate of a first conductivity type with a first insulating layer formed on the semiconductor substrate and a thin film field effect transistor with a control gate containing a refractory metal silicide formed on the semiconductor substrate over the first insulating layer. A second insulating layer covers the control gate electrode. A semiconductor film is formed on the semiconductor substrate over the first and second insulating layers and having a first region of a second conductivity type opposite to the first conductivity type. A second region of the first conductivity type is formed in contact with a first end of the first region. A third region of the first conductivity type is formed in contact with a second end of the first region. The control gate electrode and a part of the first region are overlapped with each other over the second insulating layer. The second end of the first region is apart from the second side surface of the control gate electrode by a distance more than a thickness of a part of the second insulating layer covering a side surface of the control gate electrode and does not overlap with the control gate electrode, wherein the second and third regions serve as a source and a drain of the thin film field effect transistor, respectively.

REFERENCES:
patent: 4654121 (1987-03-01), Miller et al.
patent: 4931411 (1990-06-01), Tigelaar et al.
patent: 4980732 (1990-12-01), Okazawa
patent: 5151374 (1992-09-01), Wu
patent: 5187114 (1993-02-01), Chan et al.
patent: 5252502 (1993-10-01), Havemann
patent: 5275964 (1994-01-01), Hayden
patent: 5327003 (1994-07-01), Itabashi et al.
patent: 5385854 (1995-01-01), Batra et al.
patent: 5397718 (1995-03-01), Furuta et al.
patent: 5495119 (1996-02-01), Ikeuchi
patent: 5600153 (1997-02-01), Manning
N. Okazaki et al., IEEE J. Solid State Circuits, 19(5)(1984)552 "A 16 ns 2K .times.8 Bit Full CMOS SRAM" Oct. 1984.
J.-M. Hwang et al., IEDM Proc. '92, p. 345, "Novel polysilicon/TiN stacked-gate . . SOI/CMOS" 1992.
M. Wittmer et al., Thin Solid Films 93(1982)397 "Applications of TiN thin films . . . " 1982.
S. Wolf, "Silicon Processing for the VLSI Era", vol. II, pp. 321-322, 1990.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacture of thin film transistor SRAM device with a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacture of thin film transistor SRAM device with a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacture of thin film transistor SRAM device with a will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1874918

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.