Lead frame having at least two islands and resin molded semicond

Details Lead frame having at least two islands and resin molded semicond Lead frame having at least two islands and resin molded semicond

1991-03-01

1992-06-30

Epps, Georgia Y.

357 72, 357 75, H01L 2348

Patent

active

051268230

ABSTRACT:
A lead frame for a multichip type semiconductor device includes at least two square or rectangular islands each of which has four sides and is supported by island supports. Each of the sides of the islands is not parallel to each of the sides of the lead frame to reduce an unwanted bend of leads.

REFERENCES:
patent: 4282544 (1981-08-01), Nowak
patent: 4750029 (1988-06-01), Futasuka et al.
patent: 4794431 (1988-12-01), Park
patent: 4977441 (1990-12-01), Ohtani et al.
patent: 4977442 (1990-12-01), Suzuki et al.
Japanese Patent Abstract for Appln. No. 58-73144, vol. 9, No. 61 Mar. 19, 1985, application published Nov. 10, 1984.
Japanese Patent Abstract for Appln. No. 58-251388, vol. 9, No. 298 Nov. 26, 1985, application published Jul. 20, 1985.
Japanese Patent Abstract for Appln. No. 57-223267, vol. 8, No. 231 Oct. 24, 1984, application published Jun. 30, 1984.

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