Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
Inventor
active
Chip size package and method of manufacturing the same
Lead frame having at least two islands and resin molded semicond
Manufacturing method of film carrier tape, manufacturing apparat
Method of manufacturing a molded plastic article and a glass...
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Profile ID: LFUS-PAI-P-1684499