Flip chip monolithic microwave integrated circuit with mushroom-

Details Flip chip monolithic microwave integrated circuit with mushroom- Flip chip monolithic microwave integrated circuit with mushroom-

1997-02-21

1998-06-30

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257777, 257735, 257737, 257724, 257728, H05K 109, H01L 2946

Patent

active

057738971

ABSTRACT:
Mushroom-shaped, solder-capped, small-diameter (approximately 50 to 75 microns or less), metal bumps are used in the flip chip monolithic microwave integrated circuits (MMICs) attachment process to provide devices having improved solder volume uniformity. The operation of the MMIC device is extended to millimeter-wave frequencies. The self-alignment property of the solder reflow flip chip attachment process is retained, and enhanced by the solder cap that extends beyond the periphery of the metal bump. Solder flux instead of solder paste patterns are printed on the assembly substrate to facilitate flip chip attachment. The metal bumps comprise electroplated silver pillars having a first diameter capped with electroplated solder having a second diameter, where the second diameter is larger than the first diameter, and are formed using a multi-layer negative photoresist, multiple exposure processing sequence.

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patent: 5108027 (1992-04-01), Warner et al.
patent: 5406122 (1995-04-01), Wong et al.
patent: 5508561 (1996-04-01), Tago et al.
patent: 5510758 (1996-04-01), Fujita et al.
patent: 5514838 (1996-05-01), Wen et al.
patent: 5569960 (1996-10-01), Kumazawa et al.
patent: 5616512 (1997-04-01), Wen et al.
patent: 5629241 (1997-05-01), Matloubian et al.

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