Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor
Patent
1996-12-18
2000-06-20
Chaudhari, Chandra
Semiconductor device manufacturing: process
Formation of semiconductive active region on any substrate
Amorphous semiconductor
438487, 438488, 438149, H01L 2120
Patent
active
060777583
ABSTRACT:
After a pattern is transferred on silicon film crystallized by annealing, the silicon film is annealed by radiation of intense rays for a short time. Especially, in the crystallizing process by annealing, an element which promotes crystallization such as nickel is doped therein. The area not crystallized by annealing is also crystallized by radiation of intense rays and a condensed silicon film is formed.
After a metal element which promotes crystallization is doped, annealing by light for a short time is performed by radiating intense rays onto the silicon film crystallized by annealing in an atmosphere containing halide. After the surface of the silicon film is oxidized by heating or by radiating intense rays in a halogenated atmosphere and an oxide film is formed on the silicon film, the oxide film is then etched. As a result, nickel in the silicon film is removed.
REFERENCES:
patent: Re28385 (1975-04-01), Mayes
patent: Re28386 (1975-04-01), Heiman et al.
patent: 4226898 (1980-10-01), Ovshinsky et al.
patent: 4231809 (1980-11-01), Schmidt
patent: 4300089 (1981-11-01), Chang
patent: 4300989 (1981-11-01), Chang
patent: 4309224 (1982-01-01), Shibata
patent: 4331709 (1982-05-01), Risch et al.
patent: 4379020 (1983-04-01), Glaeser et al.
patent: 5043224 (1991-08-01), Jaccodine et al.
patent: 5145808 (1992-09-01), Sameshima et al.
patent: 5147826 (1992-09-01), Liu et al.
patent: 5200630 (1993-04-01), Nakamura et al.
patent: 5221423 (1993-06-01), Sugino et al.
patent: 5225355 (1993-07-01), Sugino et al.
patent: 5254480 (1993-10-01), Tran
patent: 5262350 (1993-11-01), Yamazaki et al.
patent: 5262654 (1993-11-01), Yamazaki
patent: 5275851 (1994-01-01), Fonash et al.
patent: 5278093 (1994-01-01), Yonehara
patent: 5296405 (1994-03-01), Yamazaki et al.
patent: 5298075 (1994-03-01), Lagendijk
patent: 5308998 (1994-05-01), Yamazaki et al.
patent: 5313075 (1994-05-01), Zhang et al.
patent: 5352291 (1994-10-01), Zhang et al.
patent: 5366926 (1994-11-01), Mei et al.
patent: 5403772 (1995-04-01), Zhang et al.
patent: 5424230 (1995-06-01), Walai
patent: 5488000 (1996-01-01), Zhang et al.
patent: 5529937 (1996-06-01), Zhang et al.
patent: 5550070 (1996-08-01), Funai et al.
patent: 5595944 (1997-01-01), Zhang et al.
patent: 5605846 (1997-02-01), Ohtani et al.
patent: 5612250 (1997-03-01), Ohtani et al.
patent: 5639698 (1997-06-01), Yamazaki et al.
patent: 5646424 (1997-07-01), Zhang et al.
patent: 5773846 (1998-06-01), Zhang et al.
patent: 5869363 (1999-02-01), Yamazaki et al.
patent: 5888857 (1999-03-01), Zhang et al.
patent: 5897347 (1999-04-01), Yamazaki et al.
patent: 5904770 (1999-05-01), Ohtani et al.
R. Kakkad et al., "Crystallized Si films by low-temperature rapid thermal annealing of amorphous silicon," J. Appl. Phys., 65(5), Mar. 1, 1989, pp. 2069-2072.
G. Liu et al., "Polycrystalline silicon thin film transistors on Corning 7059 glass substrate using short time, low-temperature processing," Appl. Phys. Lett. 62(20), May 17, 1993, pp. 2554-2556.
G. Liu et al., "Selective area crystallization of amorphous silicon films by low-temperature rapid thermal annealing," Appl. Phys. Lett. 55(7), Aug. 14, 1989, pp. 660-662.
R. Kakkad et al., "Low Temperature Selective Crystallization of Amorphous Silicon," Journal of Non-Crystalline Solids, 115, 1989, pp. 66-68.
C. Hayzelden, et al., "In situ transmission electron microscopy studies of silicide-mediated crystallization of amorphous silicon," (3 pages), J. Appl. Phys. 73 (1993) 8279.
S. Takenaka et al., Jpn. J. Appl. Phys. 29(12) (1990) L2380, "High Mobility Poly-Si TFTs Using SPC a-Si Films Deposited by PECVD".
T. Hempel et al., Solid State Communications, vol. 85, #11, pp 921-92 Mar. 93, Received after Mar. 22, 1993.
A.V. Dvurechenskii et al., Phys. status sol., A95, p 635 (1986).
J.M. Green et al., IBM Tech. Discl. Bulleti, 16(5) (1973) 1612 "Method to Purify Semiconductor Wafers".
Y. Kawazu et al., J.J. Appl. Phys., 29, 12(1990) 2698 "Low temperature crystallization of a-Si:H by NiSi.sub.2 . . .".
C. Hayzelden et al., J. Appl. Phys., 73, 12 (1993) 8279 ". . . Silicide Mediated Recrystallization of Q-Si:Ni . . .".
C. Hayzelden et al., Appl. Phys. Lett., 60,2(1992) 225 ". . . Silicide Mediated Crystallization of a-Si".
A.Y. Kuznetsov et al., Inst. Phys. Conf. Ser #134.4, Proceedings of Royal Microscopical Soc. conf. 1993, p. 191.
Y.N. Erokhin, et al., Appl. Phys. Lett., 63,23 (1993) 3173 "Spatially Confined NiSi.sub.2 Formation On . . . Premorphised Si".
J. Stoemnos et al., Appl. Phys. Lett., 58,11 (1991) 1196 "Crystallization of Q-Si . . . Utilizing Gold".
J.L. Batstome et al., Solid State Phenomena, 37-38 (1994) 257 Microscopic Processes in Crystallization.
A.Y. Kuznetsov, et al., Nucl Insts. Meth. Phys. Res., B80/81 (1993) 990, "Recrystallization of a-Si Due to niSi . . .".
R.C. Cammasata et al., J. Mater. Res., 5,10(1990) 2133 "Silicide Precipitation and Si Crystallization in a-Si:Ni".
J.J.P. Bruines et al., Appl. Phys Lett, 50, 9(1987) 507 ". . . Pulsed Laser Annealing of a-Si".
Ohnuma Hideto
Takemura Yasuhiko
Zhang Hongyong
Chaudhari Chandra
Pert Evan
Robinson Eric J.
Semiconductor Energy Laboratory Co,. Ltd.
LandOfFree
Method of crystallizing thin films when manufacturing semiconduc does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of crystallizing thin films when manufacturing semiconduc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of crystallizing thin films when manufacturing semiconduc will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1851612