Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
1993-06-02
1995-09-19
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
257759, 257760, 257763, 257764, 257774, H01L 2348, H01L 2946, H01L 2954, H01L 2962
Patent
active
054518199
ABSTRACT:
A semiconductor device adapted for reduction in size and increasing density is disclosed. The semiconductor device comprises an insulating layer having therein a contact hole in which a first conductive layer or a contact electrode is deposited for connecting a semiconductor active region with an overlying second conductive layer. The contact electrode has a top portion protruding from the insulating layer and a side surface in contact with the second conductive layer for increasing a contact area between the contact electrode and the second conductive layer. The top surface of the contact electrode may be provided with an insulating layer between the top surface and the interconnection wiring layer formed from the second conductive layer in order to avoid etching of the contact electrode and underlying semiconductor active region during etching of the second conductive layer, even in the case of misalignment of the contact electrode with the interconnection wiring layer.
REFERENCES:
patent: 4914056 (1990-04-01), Okumura
Crane Sara W.
Jr. Carl Whitehead
NEC Corporation
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