Method for preparing a printed circuit board with solder plated

Details Method for preparing a printed circuit board with solder plated Method for preparing a printed circuit board with solder plated

1986-04-24

1987-06-09

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 156656, 156902, 156904, 427 97, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

046718540

ABSTRACT:
The invention provides a method for preparing a printed circuit board with solder plated circuit and through-holes, using a specifically prepared photoresist material and a combination of exposure, development, solder plating and etching means.
This method is particularly useful for the preparation of a printed circuit-board with solder plated circuit and through-holes bearing a high density circuit pattern.

REFERENCES:
patent: 4325780 (1982-04-01), Schulz
patent: 4487654 (1984-12-01), Coppin

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