Plasma etching method

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156646, 156657, 156662, 156345, H01L 2100

Patent

active

050890832

ABSTRACT:
A plasma etching method including the steps of mounting an object to be processed in a region formed between one electrode and an other electrode, introducing an etching gas into the region, setting an area of the contact surface of the other electrode, which is in contact with the etching gas, to a predetermined value in accordance with a predetermined selection ratio used in etching the object, generating plasma of the etching gas by applying a predetermined electric power between the electrodes after setting the area of the contact surface of the other electrode, which is in contact with the etching gas, to the predetermined value, and etching the object by the plasma.

REFERENCES:
patent: 4534816 (1985-08-01), Chen et al.
patent: 4563561 (1989-09-01), Freeman et al.
patent: 4565661 (1986-01-01), Kakehi et al.
patent: 4931136 (1990-06-01), Pausch et al.

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