Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Patent
1992-03-02
1993-06-01
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With large area flexible electrodes in press contact with...
257673, 257675, 257734, 257737, 257773, 257774, 174 524, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
052162788
ABSTRACT:
A semiconductor device (10) having first and second wiring layers (30, 33) on opposite surfaces of a carrier substrate (12) interconnected through vias (32) formed in the carrier substrate (12) electrically coupling an electronic component (18) to a mounting substrate through compliant solder balls (26) displaced away from vias (32), the semiconductor device (10) characterized by a standard size carrier substrate (12) having high performance electrical package interconnections (24) and good heat dissipation. Improved electrical performance is obtained by providing independent wiring layers (30, 33) each having a lead trace layout specifically designed for a particular electronic component (18) and a particular board connection requirement while using a standard size package outline. Assembly costs are reduced by providing a plastic package mold (36) over a standard size carrier substrate (12) capable of supporting a variety of different electronic components (18) themselves having varying dimensions.
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K. Moore et al., "Solder Joint Reliability of Fine Pitch Solder Bumped Pad Array Carriers", Proceedings of the Intern'l Engineering Packaging Soc., pp. 264-274, Anaheim, Calif., Sep. 1988.
E. Stephans, "Pinless Module Connector", IBM Tech. Disc. Bull. 20, (10), Mar. 1978.
Lin Paul T.
McShane Michael B.
Wilson Howard P.
Dockrey Jasper W.
James Andrew J.
Jr. Carl Whitehead
Motorola Inc.
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