Electrostatic chuck

Details Electrostatic chuck Electrostatic chuck

1986-09-04

1987-05-12

Gellner, Michael L.

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

361230, H01F 1302

Patent

active

046654631

ABSTRACT:
An electrostatic chuck (1) for holding a semiconductor wafer (5) comprises a dielectric layer (4) on a supporting electrode (2). The wafer is clamped flat against the dielectric layer when a potential difference is applied between the wafer and the electrode. The dielectric is loaded with a thermally conductive material to improve the dissipation of heat generated in the wafer during a processing treatment such as exposure to an electron beam. The dielectric also has charge retention properties so that the wafer can be transported still clamped to the chuck without the need for a permanent electrical connection nor additional mechanical clamping members.

REFERENCES:
patent: 3582730 (1971-06-01), Teston
patent: 4184188 (1980-01-01), Briglia
patent: 4480284 (1984-10-01), Tojo et al.
patent: 4502094 (1985-02-01), Lewin et al.

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