Method of packaging an integrated circuit

Details Method of packaging an integrated circuit Method of packaging an integrated circuit

1996-05-15

1997-12-23

Picardat, Kevin

Fishing, trapping, and vermin destroying

437209, 437211, 437215, H01L 2160

Patent

active

057007233

ABSTRACT:
A method of packaging an integrated circuit. The integrated circuit is connected to a substrate, and a mold is applied to the substrate. The mold and the substrate define a cavity and at least one covered chase, and the integrated circuit is disposed within the cavity. A compound is injected into the cavity through one of the covered chases, underfilling and encapsulating the integrated circuit. In one embodiment the mold is then removed from the substrate. In an alternate embodiment the mold is fixedly applied to the substrate.

REFERENCES:
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 5101324 (1992-03-01), Sato
patent: 5134773 (1992-08-01), LeMaire et al.
patent: 5139969 (1992-08-01), Mori
patent: 5179039 (1993-01-01), Ishida et al.
patent: 5249101 (1993-09-01), Frey et al.
patent: 5264393 (1993-11-01), Tamura et al.
patent: 5450283 (1995-09-01), Lin et al.
patent: 5461197 (1995-10-01), Hiruta et al.
patent: 5482896 (1996-01-01), Tang
patent: 5579208 (1996-11-01), Howda et al.

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