Photopatternable dielectric compositions, method for making and

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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430287, 430919, 20415913, G03C 170

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active

045158878

ABSTRACT:
There is provided a photosensitive modified silicone-aromatic polyamide acid convertible to a patterned silicone-polyimide. A silicone-polyamide acid is modified with an isocyanatoalkylacrylate to produce a silicone-aromatic polyamide acid having acrylate alkylamide groups attached to the silicone-aromatic polyamide acid backbone by nitrogen-nuclear bound carbon linkages.

REFERENCES:
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patent: 4017340 (1977-04-01), Yerman
patent: 4321319 (1982-03-01), Shoji et al.
Photosensitive Polyimide Siloxane for Electronic Applications, Davis, Organic Coatings and Applied Polymer Science Proceedings, vol. 48, 3/20-25/83.
Production of Highly Heat-Resistant Film Patterns from Photoreactive Polymeric Precursors, Part 1, General Principle, Rubner, Siemens Forsch--u. Entwickl-Ber. Bd. 5, (1976), Nr. 2, Springer-Verlag, (1976).
Production of Highly Heat-Resistant Film Patterns from Photoreactive Polymeric Precursors, Part 2, Polyimide Film Patterns, Rubner, Siemens Forsch--u. Entwickle-Ber. Bd. 5, (1976), Nr. 2, Springer-Verlag, (1976).
A Photopolymer--The Direct Way to Polyimide Patterns, Rubner et al., Photographic Science and Engineering, Coden Psenac 23 (5) 257 322, (1979), pp. 303-309.
New Developments in Photosensitive Polyimides, Merrem et al., E. Merck, Research and Development Dept., pp. 3-14.
Preliminary Data Sheet, Selectilux HTR-2, (ZLI 2354), Polyimide Precursor Photoresist, E.N. Chemicals, 5 Skyline Drive, Hawthorne, New York 10532, prior to 5/31/83.

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