Methods and apparatus for polishing a semiconductor wafer

Details Methods and apparatus for polishing a semiconductor wafer Methods and apparatus for polishing a semiconductor wafer

1982-01-28

1983-02-15

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

511345R, 51281R, 156662, B24B 500, B24B 100, H01L 21306

Patent

active

043739911

ABSTRACT:
A semiconductor wafer (31) is placed in a holder (10) and then positioned on a polishing pad (35) in a polishing machine (40). A mechanical force is applied to the holder (10) to cause a predetermined pressure on the wafer (31) therein as the polishing pad (35) is rotated. Simultaneously, water at a pressure slightly higher than the pressure applied to the wafer (31) is injected into the holder to form a water bearing layer between the wafer and the holder that permits free floating rotative motion of the wafer as it is being polished.

REFERENCES:
patent: 3063206 (1962-11-01), Meyerhoff et al.
patent: 3549439 (1970-12-01), Kaneggia et al.
patent: 3930914 (1976-01-01), Hetrich
patent: 4021278 (1977-05-01), Hood et al.
patent: 4165252 (1979-08-01), Gibbs
patent: 4256535 (1981-03-01), Banks

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