Encapsulation of electronic components

Details Encapsulation of electronic components Encapsulation of electronic components

1994-10-28

1996-07-16

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 174 35R, 257713, 257659, 361818, H05K 720

Patent

active

055373429

ABSTRACT:
For physical protection and to reduce stress, an electronic device (10) is mounted within a cavity in a housing (14) which constitutes an encapsulating member. The housing is preferably formed as two premoulded piece parts (14a, 14b). A leadframe (12) extends into the housing (14) in the manner of a sandwich construction. The device (10) may be mounted on a heat sink (16).

REFERENCES:
patent: 4303934 (1981-12-01), Stitt
patent: 4369330 (1983-01-01), Pilz
patent: 4474685 (1984-10-01), Annis
patent: 4545926 (1985-10-01), Fouts, Jr. et al.
patent: 4751611 (1988-06-01), Arai
patent: 4829403 (1989-05-01), Harding
patent: 4855868 (1989-08-01), Harding
patent: 5034800 (1991-07-01), Marchisi
patent: 5158707 (1992-10-01), Vestberg et al.
Patent Abstracts of Japan, vol. 007, No. 267, (E-213) 29 Nov. 1983 & JP, A,58 148 440 (Toshiba Chemical KK.) 3 Sep. 1983.

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