Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-04-19
1987-03-17
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29576W, 29580, 156648, 156657, 1566611, 156662, 357 51, 357 59, 357 65, H01L 21306, B44C 122, C03C 1500, C23F 102
Patent
active
046505440
ABSTRACT:
A shallow capacitor cell is formed by using conventional integrated circuit processes to build a substrate mask having sublithographic dimensions. Multiple grooves, or trenches, are etched into the substrate using this mask. The capacitor dielectric layer and plate are then formed in the grooves.
REFERENCES:
patent: 4017885 (1977-04-01), Kendall et al.
patent: 4449287 (1984-05-01), Maas et al.
patent: 4476623 (1984-10-01), El-Kareh
patent: 4478655 (1984-10-01), Nagakubo et al.
Sunami et al., "A Corrugated Capacitor Cell (CCC)," IEEE Transactions on Electron Devices, vol. ED-31, No. 6, Jun. 1984.
Erb Darrell M.
Selcuk Asim A.
Advanced Micro Devices , Inc.
King Patrick T.
Powell William A.
Valet Eugene H.
LandOfFree
Shallow groove capacitor fabrication method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Shallow groove capacitor fabrication method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Shallow groove capacitor fabrication method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1787010