Microelectronic bond ribbon design

Details Microelectronic bond ribbon design Microelectronic bond ribbon design

1996-10-24

2000-06-27

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257775, H01L 2348, H01L 2352, H01L 2940

Patent

active

060810351

ABSTRACT:
An improved bond ribbon design, said bond ribbon having a dual taper that functions to localize the bending along a predetermined distribution of the bond ribbon during the bonding of the bond ribbon to an associated contact of a semiconductor chip. Use of the dual-tapered bond ribbons during bonding provides a bonded bond ribbon having a form that is substantially s-shaped. The radii of curvature making out the curves of the s-shaped configuration can be predetermined and controlled by the length and taper of the individual tapered section. The improved bond ribbon further comprises an anchor pad, said anchor pad characterized by a large surface area that decreases the likelihood of delamination of it from a supporting dielectric structure. A multiplicity of these improved bond ribbons can be fabricated in an external connection component so as to facilitate the alignment and bonding process of multiple bond ribbons to corresponding contacts of the semiconductor chip and can be designed, configured or placed such that the corner contact of the semiconductor chip are accessible for bonding. With respect to the problems associated with accessing the corner contacts of a semiconductor chip when using the connection component, three approaches are offered as solutions.

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