Sequential build-up organic chip carrier and method of manufactu

Details Sequential build-up organic chip carrier and method of manufactu Sequential build-up organic chip carrier and method of manufactu

1998-04-10

2000-06-27

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438667, 438106, H01L 2144

Patent

active

060806680

ABSTRACT:
A method for manufacturing electronic circuit assemblies. A layer of dielectric material is attached to a layer of electrically conductive material. Vias are formed in the layer of dielectric material and filled with conductive paste material. The resulting assembly is attached to a substrate. Because the vias are formed and filled before the dielectric layer is attached to the substrate, it is not necessary to scrap the entire multi-layer structure, which includes the substrate and all the attached layers, when a problem occurs during via formation or filling. This increases the overall yield for the entire circuit assembly manufacturing process.

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New Avenue for Microvias, Electronic Engineering Times, Mar. 18, 1996, p. 68.

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