Method and apparatus for attaching particles to a substrate

Details Method and apparatus for attaching particles to a substrate Method and apparatus for attaching particles to a substrate

1999-01-20

2000-06-27

Elms, Richard

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438618, H01L 2144

Patent

active

060806508

ABSTRACT:
A method for attaching particles (12) to a substrate (14), comprising the steps of transferring adhesive areas (30) from an adhesive stamp (35) to contact pads (42) of the substrate (14), and depositing the particles (12) onto the adhesive areas (30) on the contact pads (42), thereby attaching the particles (12) to the substrate (14). The adhesive stamp (35) may comprise a stamp (20) having at least one projection (22) and an adhesive material applied thereon. The stamp (20) may be composed of silicon, silicone rubber or metal. The adhesive material may be composed of an adhesive polymer or an adhesive flux.

REFERENCES:
patent: 4996078 (1991-02-01), Langowshi
patent: 5608155 (1997-03-01), Ye et al.
patent: 5782399 (1995-12-01), Lapastora

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