Method and apparatus for cooling a sputtering target

Details Method and apparatus for cooling a sputtering target Method and apparatus for cooling a sputtering target

1995-03-06

1996-10-29

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429809, C23C 1434

Patent

active

055693610

ABSTRACT:
Method and apparatus for cooling a sputtering target is provided. The method comprises the steps of providing a sputtering target and a cooling surface in operable conductive heat transfer contact with the sputtering target, introducing a cooling liquid onto the cooling surface to conductively remove heat from the sputtering target, allowing at least a portion of the cooling liquid to change phase into a vapor, and preventing a continuous insulating vapor layer from forming on the cooling surface to ensure continuing conductive heat transfer from the target to the cooling surface so as to avoid overheating of the target. The apparatus comprises a cooling surface in operable conductive heat transfer contact with the sputtering target to conductively remove heat from the target when a cooling liquid is introduced onto the cooling surface, and means for allowing at least a portion of the cooling liquid to change phase into a vapor while preventing a continuous insulating vapor layer from forming on the cooling surface to ensure continuing conductive heat transfer from the target to the cooling surface so as to avoid overheating of the target.

REFERENCES:
patent: 5130005 (1992-07-01), Hurwitt et al.
patent: 5171415 (1992-12-01), Miller et al.
patent: 5180478 (1993-01-01), Hughes
patent: 5372333 (1994-12-01), Uwira et al.

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