Mechanism and method for mechanically removing a substrate

Details Mechanism and method for mechanically removing a substrate Mechanism and method for mechanically removing a substrate

1995-02-16

1996-10-29

Kunemund, Robert

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118723E, 118728, 118729, 118500, 20429815, C23F 102, C23C 1600

Patent

active

055693504

ABSTRACT:
A mechanism for completely separating a substrate, such as a semiconductor substrate, from at base in such a way that the substrate is in a horizontal position and can be easily removed from an electrostatic chuck. The substrate is mounted on a pedestal which is placed on a base such as an electrode. Pins are mounted within the base beneath a central portion of the substrate. The pins can be moved vertically through the circular pedestal to lift the substrate from the pedestal. A ring is mounted around the pedestal and underneath the outer edge of the substrate. When the pins are protrude beyond the top surface of the circular pedestal the substrate is lifted and caused to tilt. The ring then is lifted to act on the outer edge of the rear surface of the substrate, thus separating the substrate from the circular pedestal and returning the substrate to a horizontal position.

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