Method of estimating etching damage

Details Method of estimating etching damage Method of estimating etching damage

1994-09-16

1996-07-16

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566271, 1566431, 216 59, 216 61, H01L 2100

Patent

active

055363580

ABSTRACT:
The invention provides a method of estimating damage which a semiconductor substrate has suffered in a dry etching step included in a semiconductor fabricating step. The invention includes the steps of forming a delta-doped donor layer at a predetermined depth measuring from a surface of the semiconductor, measuring electron concentrations of the semiconductor before and after the dry etching step, and calculating a difference between the delta-doped donor concentrations to thereby quantitatively estimate a distribution of the damage throughout the depth of the semiconductor.

REFERENCES:
patent: 4510674 (1985-04-01), Izu et al.

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