Packaging structure for a solid-state imaging device with select

Details Packaging structure for a solid-state imaging device with select Packaging structure for a solid-state imaging device with select

1992-03-10

1993-06-29

Larkins, William D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257680, 257703, 257666, 257750, 257765, 361388, 361389, 361403, 361417, H01L 2302, H01L 2312, H02B 100, H05K 702

Patent

active

052237460

ABSTRACT:
A packaging structure is provided which is especially useful for solid-state imaging devices and other semiconductor devices. An Al film is selectively formed on inner lead portions and portions of positioning reference plates located within a ceramic packaging body. On the other hand, the outer lead portions that are exposed outside the packaging body are coated with Sn plating layer. Particular care is taken not to locate the Sn plating layer over the Al film. Contamination faults due to Sn swelling and stripping are prevented, while bonding strength of the Al clad inner lead portions with Al internal fine wires and with fit glass joining the ceramic packaging body together is kept high.

REFERENCES:
patent: 3381071 (1968-04-01), Logan et al.
patent: 4590672 (1986-05-01), Shimizu et al.
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4796083 (1989-01-01), Cherukuri et al.

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