Methods of recovering a multi-layer printed circuit board

Details Methods of recovering a multi-layer printed circuit board Methods of recovering a multi-layer printed circuit board

1992-05-21

1993-11-02

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 2940204, 2940206, 2940211, 174265, 174266, H05K 302

Patent

active

052574520

ABSTRACT:
A through hole is formed by a drill in a defective through hole in a board. An insulating resin is coated on the inner surface of the through hole and a cylindrical conductor is closely fixed with an adhesive to the hole h1 to form a reproduced through hole. Thereafter, as usual, a part lead is inserted into and soldered in the reproduced through hole to thereby recover the connection of the lead with the wiring circuit copper foil impaired by the recovering operation of the defective through hole using an external lead.

REFERENCES:
patent: 3334395 (1967-08-01), Cook et al.
patent: 3462832 (1969-08-01), Kubik

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