Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1974-04-22
1976-02-17
Tayman, Jr., James H.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
23301SP, 23273SP, 423348, B01J 1718
Patent
active
039390357
ABSTRACT:
A method for obtaining a homogeneous dislocation density in a semiconductor rod, by first subjecting the semiconductor rod in a known manner, to a crucible-free zone melting process whereby it becomes monocrystalline and free of dislocations, and thereafter an annealing zone is moved through the rod, under specified conditions.
REFERENCES:
patent: 3030194 (1962-04-01), Emeis
patent: 3441385 (1969-04-01), Schmidt
Lerner Herbert L.
Siemens Aktiengesellschaft
Tayman, Jr. James H.
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