Process for manufacturing panels to be used in microelectronic s

Details Process for manufacturing panels to be used in microelectronic s Process for manufacturing panels to be used in microelectronic s

1982-05-26

1983-09-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 156151, 156630, 156634, 156651, 156656, 156902, 174 685, 204 15, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

044040598

ABSTRACT:
The herein disclosed process comprises forming conductors of desired shape on a substrate comprised of a metal that is selectively etchable with respect to the metal of conductors, such that the conductors are formed on both sides of the substrate and that the conductors have at least one constricted portion at the substrate side opposite to that on which a base will be laminated. Then, the panel base is laminated onto the appropriate side of the substrate, and the substrate metal is etched selectively with respect to the conductor metal through the entire thickness of the substrate until the metal of the latter is fully removed from under the constricted portions only.

REFERENCES:
patent: 3801388 (1974-04-01), Akiyama et al.
patent: 4052787 (1977-10-01), Shaheen et al.

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