Methods of fabricating MIM type device arrays and display device

Details Methods of fabricating MIM type device arrays and display device Methods of fabricating MIM type device arrays and display device

1991-05-29

1993-08-10

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156655, 156656, 156657, 359 58, 359 62, 359 79, G09G 336

Patent

active

052345416

ABSTRACT:
An array of MIM type devices carried on a support together with an array of electrodes and address conductors suitable for use in an active matrix display device is fabricated using only one mask by forming on the substrate (11) a multi-layer structure comprising a lower resistive layer (30), e.g. of a-Si, an insulating layer (31) e.g. of silicon nitride and an upper conductive layer (32) and performing a patterning process, involving an etching operation whereby regions of the structure are removed to leave portions, as determined by the mask, constituting the electrodes (25), the address conductors (28) and at least one bridging portion (34) between each electrode (25) and an associated conductor (28) and whereby a part of the conductive layer (32) at each bridging portion is removed so as to form a lateral MIM type device (!0) connecting each electrode to its address conductor. Metal strips (40) may be formed bordering the edges of the electrodes and conductors by using temporary additional layers and lift-off techniques.

REFERENCES:
patent: 4413883 (1983-11-01), Baraff et al.
patent: 4653858 (1987-03-01), Szydlo et al.
patent: 4892389 (1990-01-01), Kuijk
patent: 4913674 (1990-04-01), Nicholas
patent: 5056894 (1991-10-01), Kuijk et al.
patent: 5101288 (1992-03-01), Ohta et al.

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