Method of manufacturing heterojunction bipolar device having Si.

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Having heterojunction

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438322, 438324, 438325, 438326, 438340, 438341, 438933, 148DIG10, 148DIG11, 257511, 257512, 257525, 257555, 257574, H01L 21331

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059151862

ABSTRACT:
In a semiconductor device manufacturing method for forming first and second bipolar transistors on a semiconductor substrate 1, a link base layer 5 for connecting a graft base layer (graft base layer 8) of the first bipolar transistor and an intrinsic base layer 12 to each other, and at least a part of a base layer 6 of the second bipolar transistor are formed simultaneously with each other, and then the link base layer 5 in a region where the intrinsic base layer 12 will be formed is removed by an etching treatment, and then by a selective epitaxial growth method, the intrinsic base layer 12 is formed in the region where the link base layer 5 is removed.

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