Electroless plating solution and plating method with it

Details Electroless plating solution and plating method with it Electroless plating solution and plating method with it

1993-03-12

1993-12-14

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 127, 427438, 4274431, 427 98, C23C 1834, B05D 118

Patent

active

052698386

ABSTRACT:
An electroless plating solution comprises nickel ion, a chelating agent for nickel ion, dimethylamine borane, one or more soluble salts of a condensate of an arylsulfonic acid with formalin, and thiodiglycolic acid, and an electroless plating method comprises the step of immersing a substrate to be plated in this electroless plating solution for sufficent time period to form a nickel or nickel alloy layer on the substrate. The electroless plating solution has a high bath stability and is capable of forming an excellent thick deposit free from pits and cracks.

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patent: 4740277 (1988-04-01), Klos et al.
patent: 5147454 (1992-09-01), Nishihara et al.
WPI abstract Accession No. 90-279773/37 Pretreating agent for electroless plating of polyamide resin-where at least 1 specified sulphonated cpd. of formaldehyde condensate, . . . (1990).

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