Enhanced high pressure cleansing system for wafer handling imple

Cleaning and liquid contact with solids – Apparatus – Automatic controls

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134 951, 134155, 134186, 134902, 15319, 15339, B08B 302

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active

058394559

ABSTRACT:
Methods and apparatus are providing for cleansing contaminants from substrates, such as semiconductor wafer handling implements, and thereby reduce the incidence of contamination of semiconductor devices being assembled upon the semiconductor wafers.
In one aspect of the invention, a substrate such as a semiconductor cassette or other semiconductor wafer handling implement, is inserted into a chamber that is substantially isolated from a surrounding environment. A pressurized, and optionally purified, cleansing medium is directed against at least one surface of the substrate to dislodge contaminants from the substrate surface. Dislodged contaminants are evacuated with negative pressure from the chamber. In a preferred aspect of the invention, the cleansing medium is an inert gas, such as nitrogen, and is applied to the substrate at a pressure from about 10 p.s.i. to about 100 or more p.s.i. The chamber can be provided with sidewalls define a convergent evacuation path that is in fluid communication with an exhaust stream, such as the exhaust stack of the manufacturing facility.

REFERENCES:
patent: 2602003 (1952-07-01), Wellborn
patent: 3373552 (1968-03-01), Scherr
patent: 3805317 (1974-04-01), Dickinson
patent: 3939526 (1976-02-01), Mania et al.
patent: 4141103 (1979-02-01), Crise
patent: 4364147 (1982-12-01), Biedremann et al.
patent: 4411038 (1983-10-01), Mukai
patent: 4800611 (1989-01-01), Toriwaki et al.
patent: 4991253 (1991-02-01), Rechsteiner
patent: 5243494 (1993-09-01), Cotner et al.
patent: 5279017 (1994-01-01), Foreshew
patent: 5437732 (1995-08-01), Igarashi et al.
patent: 5504972 (1996-04-01), Tada et al.

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