Method of patterning a substrate

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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20415922, 430296, 430326, B05D 306

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042333946

ABSTRACT:
A substrate is patterned by first dissolving polymethacrylonitrile in a spinning solvent that will dissolve the polymer and form a viscous solution. The solution is then applied to the surface of the substrate and the substrate spun to form a smooth, uniform resist film of at least 3000 angstroms in thickness. The resist film is heated and the region of the resist film to be patterned is then exposed to ionizing radiation until the dissolution rate of the irradiated region of the resist film is greater than five times the dissolution rate of the unirradiated region of the resist film. The exposed regions of the resist film are then developed to the substrate in a mixture of acetonitrile or benzonitrile and toluene.

REFERENCES:
patent: 3231552 (1966-01-01), Natta et al.
patent: 3253058 (1966-05-01), Isley et al.
patent: 3539542 (1970-11-01), Nakatsuka et al.
patent: 3574177 (1971-04-01), Nakajima et al.
Haller et al., "IBM Journal" vol. 12, May 1968 pp. 251-256.
Ku et al., "J. Electrochem Soc.: Solid State Science" vol. 116 No. 7 Jul. 69 pp. 980-985.
Helbert et al., "J. Electrochem Soc." vol. 126 No. 4 Apr. 1979 pp. 694-696.

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