Stress relief layer providing high thermal conduction for a semi

Details Stress relief layer providing high thermal conduction for a semi Stress relief layer providing high thermal conduction for a semi

1990-10-11

1992-07-28

Mintel, William

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 357 71, 361388, 361389, H01L 2302, H01L 2312

Patent

active

051344637

ABSTRACT:
A semiconductor chip (27) is soldered on an electrode plate (24) with a thermal relaxation plate (40) therebetween. The thermal relaxation plate has a frame member (41) made of covar or invar and a plate member (42) made of copper. The plate member is inserted into the window space defined in the frame member and is united with the frame member.

REFERENCES:
patent: 3296501 (1967-01-01), Moore
patent: 3399332 (1968-08-01), Savolainen
patent: 4427993 (1984-01-01), Fichot et al.
patent: 4825284 (1989-04-01), Soga et al.

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