Method for making integrated circuit having polymer interlayer d

Details Method for making integrated circuit having polymer interlayer d Method for making integrated circuit having polymer interlayer d

1999-05-12

2000-03-14

Chaudhari, Chandra

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438647, 438725, 438780, H01L 21283

Patent

active

060372559

ABSTRACT:
An improved method for making an integrated circuit that includes forming a conductive layer on a substrate, then forming a dielectric layer comprising a polymer on the conductive layer. After forming the dielectric layer, a layer of photoresist is patterned to define a region to be etched. An etched region is then formed through the dielectric layer while simultaneously removing the layer of photoresist.

REFERENCES:
patent: 5354712 (1994-10-01), Ho et al.
patent: 5889141 (1999-03-01), Marrocco, III et al.

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