Method of depositing films using photo-CVD with chamber plasma c

Fishing – trapping – and vermin destroying

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148DIG17, 148DIG43, 148DIG45, 427 531, 437170, 437173, 437238, 437241, 437978, 437925, H01L 21469

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active

049506242

ABSTRACT:
An improved CVD apparatus for depositing a uniform film is shown. The apparatus comprises a reaction chamber, a substrate holder and a plurality of light source for photo CVD or a pair of electrode for plasma CVD. The substrate holder is a cylindrical cart which is encircled by the light sources, and which is rotated around its axis by a driving device. With this configuration, the substrates mounted on the cart and the surroundings can be energized by light or plasma evenly throughout the surfaces to be coated.

REFERENCES:
patent: 4015558 (1977-04-01), Small et al.
patent: 4495218 (1985-01-01), Azuma et al.
patent: 4529474 (1985-07-01), Fujiyma
patent: 4546535 (1985-10-01), Shepard
patent: 4579609 (1986-04-01), Reif et al.
patent: 4597986 (1986-07-01), Scapple et al.
patent: 4601260 (1986-07-01), Ovshinsky
patent: 4612207 (1986-09-01), Jansen
patent: 4636401 (1989-01-01), Yamazaki et al.
patent: 4657616 (1987-04-01), Benzing et al.
patent: 4705912 (1987-11-01), Nakashima et al.
patent: 4709655 (1987-12-01), Van Mastrigt
patent: 4719123 (1988-01-01), Haku et al.
patent: 4735822 (1988-04-01), Ohtoshi et al.
patent: 4766091 (1988-08-01), Ohtoshi et al.
patent: 4772570 (1988-09-01), Kanai et al.
patent: 4796562 (1989-01-01), Brors et al.
patent: 4808553 (1989-02-01), Yamazaki
patent: 4810673 (1989-03-01), Freeman
patent: 4848272 (1989-07-01), Ohmura et al.
patent: 4857139 (1989-08-01), Tashiro et al.

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